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NTNUS3171PZ
PACKAGE DIMENSIONS
SOT ? 1123
CASE 524AA ? 01
ISSUE B
e
c
b1
1
2
D
H E
3
? X ?
? Y ?
E
b
0.08 (0.0032) X Y
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MILLIMETERS INCHES
DIM  MIN   NOM  MAX   MIN   NOM  MAX
A 0.34 0.37 0.40 0.013 0.015 0.016
b 0.15 0.22 0.28 0.006 0.009 0.011
b1 0.10   0.15   0.20   0.004  0.006  0.008
c 0.07 0.12 0.17 0.003 0.005 0.007
D 0.75 0.80 0.85 0.030 0.031 0.033
E 0.55 0.60 0.65 0.022 0.024 0.026
e 0.35 ??? 0.40 0.014 ???? 0.016
H E 0.95   1.00   1.05   0.037  0.039  0.041
L 0.05 0.10 0.15 0.002 0.004 0.006
SOLDERING FOOTPRINT*
0.35
0.25
0.90
0.30
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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NTNUS3171PZ/D
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